100% made in usa
Our U.S.-based engineering support ensures your designs are manufacturable before production begins. We specialize in high-density interconnects, microvias, and sequential lamination, delivering precision-engineered HDI and ultra-HDI solutions for aerospace, medical, and semiconductor applications.
01
Microvias
Laser-drilled microvias allow designers to connect adjacent layers using significantly smaller structures than conventional mechanically drilled vias.
02
Via-in-pad
Route directly from fine-pitch BGAs and other dense components by utilizing laser-drilled vias that integrate seamlessly into the pad structure.
03
Sequential Lamination
Support for complex HDI designs through multiple lamination and drilling cycles to balance routing density, reliability, and manufacturability.
04
Fine Lines & Spaces
Standard and advanced HDI capabilities down to [X/X] mil, providing the routing density required for high-speed digital systems.
05
Controlled Impedance
Engineering support for impedance-controlled HDI stack-ups, ensuring signal integrity and reliable performance in demanding applications.
06
Advanced Materials
Utilizing FR-4, high-speed/low-loss materials, and specialized dielectrics to meet the stringent requirements of aerospace and medical electronics.
DOMESTIC ADVANTAGE
Manufacturing in the United States provides direct engineering access and a secure domestic supply chain. Your designs are built with precision by U.S.-based experts, ensuring faster iterations and full protection of sensitive IP without the delays of global logistics.